Mark Miller
Business Development, Technical Support
Macrolink® is a trusted name in the design and fabrication of computing hardware components for the aerospace, defense and transportation sectors. For decades, our engineers have been innovating in the field of custom electronic assemblies, providing customers with some of the most advanced fabrication, assembly integrations and in-house testing services in the industry.
Now, as part of Collins Aerospace, our capabilities and commitment to helping customers solve challenges have grown exponentially. You can count on our skilled technicians to be well-trained on the latest assembly and testing technologies. And our products are backed by the Collins reputation for high-performance, unparalleled quality and an unwavering commitment to delivering on-time, tailored solutions for our customers.
Our ATR enclosures and rack mount chassis deliver mission-critical air, sea and ground performance in the most demanding environments. Designed for comprehensive protection against extreme conditions, these custom-built products come in a range of configurations with a variety of design options. Contact us to develop your solution.
Explore our chassis / enclosure detailed specifications and build a power-ready subsystem suited to your needs.
Custom front panel, rear panel, cooling, single or hybrid technology backplanes, standard or custom power supply solutions for power capacity and voltage rails, system monitoring and board capacity options.
Whether its high altitude situations or extreme thermal environments, effective avionics cooling is vital to prevent damage from minimized air flow and excessive heat. We eliminate overheating risk by performing thermal analysis on every system. Using native, solid-model CAD geometry, we produce a selection of shaded display, particle trace animation and clipping planes to optimize thermal performance. This analysis ensures that your thermal requirements are met early in the design process, dramatically shortening product delivery time.
After testing a variety of heat transfer types, we’ll implement a cooling solution based on specific board requirements. Our cooling solutions include:
We'll combine or alter these cooling methods as necessary to suit your thermal management needs.
Drawing from a wealth of experience, our engineers solve your most difficult electronics, interconnect and integration challenges, with a special emphasis on:
We've developed solutions for a wide range of platforms, including:
Mark Miller
Business Development, Technical Support
Customer Service